Fracture morphology and mechanism of IMC in Low-Ag SAC...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

Sun, F., Hochstenbach, P., Van Driel, W.D., Zhang, G.Q.
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Volume:
48
Language:
english
Pages:
4
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.06.011
Date:
August, 2008
File:
PDF, 941 KB
english, 2008
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