Volume 48; Issue 8-9

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Microelectronics Reliability
Volume 48; Issue 8-9

Microelectronics Reliability

Volume 48; Issue 8-9

1

Reliability and defectivity comparison of n- and p-channel SLS ELA polysilicon TFTs fabricated with a novel crystallization technique

Moschou, D.C., Exarchos, M.A., Kouvatsos, D.N., Papaioannou, G.J., Arapoyanni, A., Voutsas, A.T.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 296 KB

english, 2008

2

Compact modeling of the non-linear post-breakdown current in thin gate oxides using the generalized diode equation

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 486 KB

english, 2008

3

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

Sun, F., Hochstenbach, P., Van Driel, W.D., Zhang, G.Q.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 941 KB

english, 2008

4

PLL soft functional failure analysis in advanced logic product using fault based analogue simulation and soft defect localization

Gao, Liming, Burmer, Christian

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.08 MB

english, 2008

5

An analytical model for hot carrier degradation in nanoscale CMOS suitable for the simulation of degradation in analog IC applications

Maricau, E., De Wit, P., Gielen, G.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 208 KB

english, 2008

6

On the temperature dependence of NBTI recovery

Aichinger, T., Nelhiebel, M., Grasser, T.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 451 KB

english, 2008

7

Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations

Altes, Andreas, Tilgner, Rainer, Reissner, Markus, Steckert, Grazyna, Neumann, Gerald

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.33 MB

english, 2008

8

Simulation of migration effects in nanoscaled copper metallizations

Weide-Zaage, Kirsten, Kashanchi, Farzan, Aubel, Oliver

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.34 MB

english, 2008

9

Statistical simulation of random dopant induced threshold voltage fluctuations for 35nm channel length MOSFET

Kovac, Urban, Reid, Dave, Millar, Campbell, Roy, Gareth, Roy, Scott, Asenov, Asen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 636 KB

english, 2008

10

Determination of migration effects in Cu-via structures with respect to process-induced stress

Weide-Zaage, Kirsten, Zhao, Jiani, Ciptokusumo, Joharsyah, Aubel, Oliver

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.13 MB

english, 2008

11

Statistical aspects of reliability in bulk MOSFETs with multiple defect states and random discrete dopants

Bukhori, Muhammad Faiz, Roy, Scott, Asenov, Asen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 823 KB

english, 2008

12

Thermal resistance assessment in multi-trenched power devices

Roig, J., Desoete, B., Bauwens, F., Lovadina, F., Moens, P.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.23 MB

english, 2008

13

IGBT module failure analysis in railway applications

Perpiñà, X., Serviere, J.F., Jordà, X., Fauquet, A., Hidalgo, S., Urresti-Ibañez, J., Rebollo, J., Mermet-Guyennet, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.35 MB

english, 2008

14

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Yang, Yu, Bender, Hugo, Arstila, Kai, Swinnen, Bart, Verlinden, Bert, Wolf, Ingrid De

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 902 KB

english, 2008

15

Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies

Chen, F., Bravo, O., Harmon, D., Shinosky, M., Aitken, J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.73 MB

english, 2008

16

On chip–package stress interaction

van Driel, W.D., Yang, D.G., Zhang, G.Q.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 2.26 MB

english, 2008

17

Packaging influences on the reliability of MEMS resonators

Zaal, J.J.M., van Driel, W.D., Bendida, S., Li, Q., van Beek, J.T.M., Zhang, G.Q.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 912 KB

english, 2008

18

Detection of localized UIS failure on IGBTs with the aid of lock-in thermography

Breglio, G., Irace, A., Napoli, E., Riccio, M., Spirito, P., Hamada, K., Nishijima, T., Ueta, T.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 549 KB

english, 2008

19

Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations

Aubert, A., Dantas de Morais, L., Rebrassé, J.-P.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

20

Sulfur-contamination of high power white LED

Mura, G., Cassanelli, G., Fantini, F., Vanzi, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 654 KB

english, 2008

21

Insights on trap generation and breakdown in ultra thin SiO2 and SiON dielectrics from low voltage stress-induced leakage current measurements

Nicollian, Paul E.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 897 KB

english, 2008

22

Relevant metrics for evaluation of concurrent error detection schemes

de Vasconcelos, Maí C.R., Franco, Denis T., Naviner, Lirida A.B., Naviner, Jean-François

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 191 KB

english, 2008

23

Voltage and temperature effect on dielectric charging for RF-MEMS capacitive switches reliability investigation

Lamhamdi, M., Pons, P., Zaghloul, U., Boudou, L., Coccetti, F., Guastavino, J., Segui, Y., Papaioannou, G., Plana, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 718 KB

english, 2008

24

Defect analysis concerning variation in characteristics of PIN diode for Hybrid Vehicles

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.03 MB

english, 2008

25

Near-field detection of photon emission from silicon with 30nm spatial resolution

Isakov, D., Tio, A.A.B., Geinzer, T., Phang, J.C.H., Zhang, Y., Balk, L.J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 651 KB

english, 2008

26

Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests

El Brouji, H., Briat, O., Vinassa, J.-M., Bertrand, N., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 231 KB

english, 2008

27

ESD sensitivity investigation on a wide range of high density embedded capacitors

Barbier, Frederic, Jacqueline, Sebastien

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.36 MB

english, 2008

28

Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency

Kalicinski, Stanislaw, Wevers, Martine, Wolf, Ingrid De

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 235 KB

english, 2008

29

High performance, FPGA-based test apparatus for unclamped inductive switching of IGBTs

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 794 KB

english, 2008

30

IGBT modules robustness during turn-off commutation

Busatto, G., Abbate, C., Abbate, B., Iannuzzo, F.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1017 KB

english, 2008

31

Failure analysis of a thin-film nitride MEMS package

Li, Q., Goosen, J.F.L., van Beek, J.T.M., van Keulen, F., Phan, K.L., Zhang, G.Q.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 749 KB

english, 2008

32

Testing semiconductor devices at extremely high operating temperatures

Borthen, Peter, Wachutka, Gerhard

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 800 KB

english, 2008

33

Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120nm and 65nm technology

Kindereit, Ulrike, Boit, Christian, Kerst, Uwe, Kasapi, Steven, Ispasoiu, Radu, Ng, Roy, Lo, William

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.51 MB

english, 2008

34

ESD issues in advanced CMOS bulk and FinFET technologies: Processing, protection devices and circuit strategies

Russ, Christian

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.09 MB

english, 2008

35

Determination of temperature change inside IC packages during laser ablation of molding compound

Schwindenhammer, P., Murray, H., Descamps, P., Poirier, P.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 589 KB

english, 2008

36

Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle

Croes, K., Cannatá, G., Zhao, L., Tőkei, Zs.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 192 KB

english, 2008

37

Dynamic stress method for accurate NVM oxide robustness evaluation for automotive applications

Pic, D., Regnier, A., Pean, V., Ogier, J.-L., Goguenheim, D.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 432 KB

english, 2008

38

Performance and reliability testing of modern IGBT devices under typical operating conditions of aeronautic applications

Fock-Sui-Too, J.L., Chauchat, B., Austin, P., Tounsi, P., Mermet-Guyennet, M., Meuret, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 655 KB

english, 2008

39

Behaviour of 1.2kV SiC JBS diodes under repetitive high power stress

Banu, V., Brosselard, P., Jordá, X., Montserrat, J., Godignon, P., Millán, J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 224 KB

english, 2008

40

Thermal heating within SOI

Koning, J.J., Lecaudey, S., Spaan, E., Stoutjesdijk, M., Janssen, J.H.J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 620 KB

english, 2008

41

Ball grid array (BGA) solder joint intermittency real-time detection

Roth, N., Wondrak, W., Willikens, A., Hofmeister, J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.40 MB

english, 2008

42

Author Index

Journal:

Microelectronics Reliability

Year:

2008

File:

PDF, 97 KB

2008

43

InGaP/GaAs heterojunction bipolar transistor and RF power amplifier reliability

Liu, Xiang, Yuan, Jiann S., Liou, Juin J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 189 KB

english, 2008

44

Voltage acceleration of time dependent breakdown of ultra-thin NO and NON dielectrics

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 734 KB

english, 2008

45

Negative bias temperature instability in n-channel power VDMOSFETs

Danković, D., Manić, I., Davidović, V., Djorić-Veljković, S., Golubović, S., Stojadinović, N.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 286 KB

english, 2008

46

Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk – Failure analysis, tool diagnosis and on-site-remedies

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 436 KB

english, 2008

47

Systems-in-foil – Devices, fabrication processes and reliability issues

van den Brand, J., de Baets, J., van Mol, T., Dietzel, A.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 921 KB

english, 2008

48

Conditional time resolved photoemission for debugging ICs with intermittent faults

Zachariasse, Frank, van Hassel, Jan

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.24 MB

english, 2008

49

Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation

Deshayes, Y., Bord, I., Barreau, G., Aiche, M., Moretto, P.H., Béchou, L., Roehrig, A.C., Ousten, Y.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1024 KB

english, 2008

50

Temperature stability of a piezoresistive MEMS resonator including self-heating

Bendida, S., Koning, J.J., Bontemps, J.J.M., van Beek, J.T.M., Wu, D., van Gils, M.A.J., Nath, S.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 651 KB

english, 2008

51

A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors

Nötzold, K., Graf, J., Müller-Fiedler, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 405 KB

english, 2008

52

Signal probability for reliability evaluation of logic circuits

Franco, Denis Teixeira, Vasconcelos, Maí Correia, Naviner, Lirida, Naviner, Jean-François

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 278 KB

english, 2008

53

Non-linear width scaling of ESD protection devices and link with p-well implant in BCD-processes

Olthof, E.H.T., de Raad, G.J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 352 KB

english, 2008

54

Degradation behavior of Ta2O5 stacks and its dependence on the gate electrode

Atanassova, E., Stojadinovic, N., Paskaleva, A.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 214 KB

english, 2008

55

Thermal storage effects on AlGaN/GaN HEMT

Danesin, Francesca, Tazzoli, Augusto, Zanon, Franco, Meneghesso, Gaudenzio, Zanoni, Enrico, Cetronio, Antonio, Lanzieri, Claudio, Lavanga, Simone, Peroni, Marco, Romanini, Paolo

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 444 KB

english, 2008

56

New aspects for lifetime prediction of bipolar transistors in automotive power wafer technologies by using a power law fitting procedure

Goroll, Michael, Pufall, Reinhard, Aresu, Stefano, Gustin, Wolfgang

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 244 KB

english, 2008

57

Generic simulator for faulty IC

Ferrigno, Julie, Machouat, Aziz, Perdu, Philippe, Lewis, Dean, Haller, Gerald, Goubier, Vincent

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 900 KB

english, 2008

58

Reliability and failure in single crystal silicon MEMS devices

Neels, A., Dommann, A., Schifferle, A., Papes, O., Mazza, E.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 571 KB

english, 2008

59

Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150°C

Feller, L., Hartmann, S., Schneider, D.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.15 MB

english, 2008

60

Nanometer-scale leakage measurements in high vacuum on de-processed high-k capacitors

Polspoel, W., Vandervorst, W., Aguilera, L., Porti, M., Nafria, M., Aymerich, X.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 627 KB

english, 2008

61

Reliability improvement of InGaN LED backlight module by accelerated life test (ALT) and screen policy of potential leakage LED

Jeong, Jae-Seong, Jung, Jin-Kyu, Park, Sang-Deuk

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.02 MB

english, 2008

62

Experimental evidence of “latent gate oxide damages” in medium voltage power MOSFET as a result of heavy ions exposure

Busatto, G., Currò, G., Iannuzzo, F., Porzio, A., Sanseverino, A., Velardi, F.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 487 KB

english, 2008

63

Reliability study of TaON capacitors: From leakage current characterization to ESD robustness prediction

Verchiani, M., Bouyssou, E., Fiannaca, G., Cantin, F., Anceau, C., Ranson, P.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 296 KB

english, 2008

64

Silicon based system in package: Improvement of passive integration process to avoid TBMS failure

Gautier, Christian, Ledain, Sophie, Jacqueline, Sébastien, Nongaillard, Matthieu, Georgel, Vincent, Danilo, Karine

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 736 KB

english, 2008

65

Impact of silicon nitride CESL on NLDEMOS transistor reliability

Beylier, G., Bruyère, S., Benoit, D., Ghibaudo, G.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 745 KB

english, 2008

66

Bridging the business model gap between the semiconductor industry and the automotive industry with respect to quality and reliability

de Jong, M., Freeman, D.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 112 KB

english, 2008

67

Reliability- and process-variation aware design of integrated circuits

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 878 KB

english, 2008

68

Effect of physical defect on shmoos in CMOS DSM technologies

Machouat, A., Haller, G., Goubier, V., Lewis, D., Perdu, P., Pouget, V., Fouillat, P., Essely, F.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.91 MB

english, 2008

69

Kelvin probe microscopy for reliability investigation of RF-MEMS capacitive switches

Belarni, A., Lamhamdi, M., Pons, P., Boudou, L., Guastavino, J., Segui, Y., Papaioannou, G., Plana, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 680 KB

english, 2008

70

Voltage-based fault path tracing by transistor operating point analysis

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 559 KB

english, 2008

71

Layout analysis as supporting tool for failure localization: Basic principles and case studies

Hartmann, C., Wieberneit, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.73 MB

english, 2008

72

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 98 KB

english, 2008

73

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 41 KB

english, 2008

74

Intermittent-contact scanning capacitance microscopy versus contact mode SCM applied to 2D dopant profiling

Biberger, Roland, Benstetter, Guenther, Schweinboeck, Thomas, Breitschopf, Peter, Goebel, Holger

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 746 KB

english, 2008

75

RF CMOS reliability simulations

Sasse, Guido T., Acar, Mustafa, Kuper, Fred G., Schmitz, Jurriaan

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 232 KB

english, 2008

76

PMOS breakdown effects on digital circuits – Modeling and analysis

Kuang, Weidong, Cao, Lizhi, Yu, C., Yuan, J.S.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 377 KB

english, 2008

77

3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET

Sauveplane, J.B., Tounsi, P., Scheid, E., Deram, A.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 615 KB

english, 2008

78

Reliability issues of e-Cubes heterogeneous system integration

Janczyk, Grzegorz, Bieniek, Tomasz, Szynka, Jerzy, Grabiec, Piotr

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.34 MB

english, 2008

79

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Yew, Ming-Chih, Yang, Wen-Kun, Chiang, Kuo-Ning

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.34 MB

english, 2008

80

Automotive IC reliability: Elements of the battle towards zero defects

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 386 KB

english, 2008

81

Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting

Martens, S., Krueger, B., Mack, W., Voelklein, F., Wilde, J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.08 MB

english, 2008

82

ESD failure signature in capacitive RF MEMS switches

Ruan, J., Papaioannou, G.J., Nolhier, N., Mauran, N., Bafleur, M., Coccetti, F., Plana, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 737 KB

english, 2008

83

Reliability aspects of a radiation detector fabricated by post-processing a standard CMOS chip

Salm, Cora, Blanco Carballo, Victor M., Melai, Joost, Schmitz, Jurriaan

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 486 KB

english, 2008

84

Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures

Jacob, Peter, Rothkirch, Werner

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 822 KB

english, 2008

85

MIMC reliability and electrical behavior defined by a physical layer property of the dielectric

Ackaert, J., Charavel, R., Dhondt, K., Vlachakis, B., De Schepper, L., Millecam, M., Vandevelde, E., Bogaert, P., Iline, A., De Backer, E., Vlad, A., Raskin, J.-P.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 204 KB

english, 2008

86

Impact of inside spacer process on fully self-aligned 250GHz SiGe:C HBTs reliability performances: a-Si vs. nitride

Diop, M., Revil, N., Marin, M., Monsieur, F., Chevalier, P., Ghibaudo, G.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 309 KB

english, 2008

87

Thermal modeling of high frequency DC–DC switching modules: Electromagnetic and thermal simulation of magnetic components

Cova, P., Delmonte, N., Menozzi, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.25 MB

english, 2008

88

Alpha particle radiation effects in RF MEMS capacitive switches

Ruan, J., Papandreou, E., Lamhamdi, M., Koutsoureli, M., Coccetti, F., Pons, P., Papaioannou, G., Plana, R.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 538 KB

english, 2008

89

Reliability assessment of integrated power transistors: Lateral DMOS versus vertical DMOS

Moens, P., Van den bosch, G.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.03 MB

english, 2008

90

Optimization of gate poly TAB size and reliability on short channel pMOSFET

Seok, Jung-Eun, Kim, Hyun-Joo, Seo, Jae-Yong, Hwang, Sam-jin, Kwak, Byung-Heon

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 279 KB

english, 2008

91

Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applications

Heer, M., Grombach, P., Heid, A., Pogany, D.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 811 KB

english, 2008

92

Reliability investigations of 850nm silicon photodiodes under proton irradiation for space applications

Bourqui, M.L., Béchou, L., Gilard, O., Deshayes, Y., Vecchio, P. Del, How, L.S., Rosala, F., Ousten, Y., Touboul, A.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 258 KB

english, 2008

93

Detectability of dynamic photon emission in static Si CCD for signal path determination in integrated circuits

Laskowski, Piotr, Glowacki, Arkadiusz, Boit, Christian

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 639 KB

english, 2008

94

NBTI on smart power technologies: A detailed analysis of two concurrent effects using a re-examined on-the-fly technique

Aresu, S., Pufall, R., Goroll, M., Gustin, W.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 349 KB

english, 2008

95

Timing analysis of scan design integrated circuits using stimulation by an infrared diode laser in externally triggered pulsing condition

Kiyan, Tuba, Brillert, Christof, Boit, Christian

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.46 MB

english, 2008

96

Electrical characterization and reliability study of HEMTs on composite substrates under high electric fields

Tazzoli, A., Meneghesso, G., Zanon, F., Danesin, F., Zanoni, E., Bove, P., Langer, R., Thorpe, J.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 891 KB

english, 2008

97

Reduction of test effort. Looking for more acceleration for reliable components for automotive applications

Pufall, R., Kanert, W., Aresu, S., Goroll, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 824 KB

english, 2008

98

Novel simulation approach for transient analysis and reliable thermal management of power devices

Castellazzi, A., Ciappa, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 821 KB

english, 2008

99

Fast and rigorous use of thermal time constant to characterize back end of the line test structure in advanced technology

Reverdy, A., Perdu, P., Murray, H., de la Bardonnie, M., Poirier, P.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 873 KB

english, 2008

100

Fast electromigration wafer mapping for wafer fab process monitoring and improvement

Li, Yuan, van Marwijk, Leo, Nath, Som

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 254 KB

english, 2008

101

Analytical model for multi-junction solar cells prediction in space environment

Gauffier, A., David, J.-P., Gilard, O.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 263 KB

english, 2008

102

Analysis of traps effect on AlGaN/GaN HEMT by luminescence techniques

Bouya, M., Malbert, N., Labat, N., Carisetti, D., Perdu, P., Clément, J.C., Lambert, B., Bonnet, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 282 KB

english, 2008

103

Influence of the organic pollution on the reliability of HE9 connectors

Crétinon, L., El Hadachi, M., Augereau, F., Doireau, L., Despaux, G.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 462 KB

english, 2008

104

Editorial

Groeseneken, Guido, Wolf, Ingrid De, Mouthaan, Anton, Bisschop, Jaap

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 101 KB

english, 2008

105

Failure Analysis enhancement by evaluating the Photoelectric Laser Stimulation impact on mixed-mode ICs

Sienkiewicz, M., Perdu, P., Firiti, A., Sanchez, K., Crepel, O., Lewis, D.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 496 KB

english, 2008

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