Simulation of migration effects in nanoscaled copper...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Simulation of migration effects in nanoscaled copper metallizations

Weide-Zaage, Kirsten, Kashanchi, Farzan, Aubel, Oliver
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Volume:
48
Language:
english
Pages:
5
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.06.025
Date:
August, 2008
File:
PDF, 1.34 MB
english, 2008
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