Determination of migration effects in Cu-via structures...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Determination of migration effects in Cu-via structures with respect to process-induced stress

Weide-Zaage, Kirsten, Zhao, Jiani, Ciptokusumo, Joharsyah, Aubel, Oliver
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Volume:
48
Language:
english
Pages:
5
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.06.028
Date:
August, 2008
File:
PDF, 1.13 MB
english, 2008
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