Thermal resistance assessment in multi-trenched power...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Thermal resistance assessment in multi-trenched power devices

Roig, J., Desoete, B., Bauwens, F., Lovadina, F., Moens, P.
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Volume:
48
Language:
english
Pages:
6
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.06.031
Date:
August, 2008
File:
PDF, 1.23 MB
english, 2008
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