Cu/low-k dielectric TDDB reliability issues for advanced...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies

Chen, F., Bravo, O., Harmon, D., Shinosky, M., Aitken, J.
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Volume:
48
Language:
english
Pages:
9
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.06.037
Date:
August, 2008
File:
PDF, 1.73 MB
english, 2008
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