Failure analysis of a thin-film nitride MEMS package

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Failure analysis of a thin-film nitride MEMS package

Li, Q., Goosen, J.F.L., van Beek, J.T.M., van Keulen, F., Phan, K.L., Zhang, G.Q.
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Volume:
48
Language:
english
Pages:
5
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.07.036
Date:
August, 2008
File:
PDF, 749 KB
english, 2008
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