Determination of temperature change inside IC packages...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Determination of temperature change inside IC packages during laser ablation of molding compound

Schwindenhammer, P., Murray, H., Descamps, P., Poirier, P.
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Volume:
48
Language:
english
Pages:
5
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.07.044
Date:
August, 2008
File:
PDF, 589 KB
english, 2008
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