RF device package method using Au to Au direct bonding...

Microelectronics Reliability 2009 Vol. 49; Iss. 1

RF device package method using Au to Au direct bonding technology

Sangwook Kwon, Jongseok Kim, Gilsu Park, Youngtack Hong, Byeongkwon Ju, Insang Song
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Volume:
49
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.microrel.2008.10.007
File:
PDF, 1023 KB
english, 2009
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