Volume 49; Issue 1

Microelectronics Reliability

Volume 49; Issue 1

1

Temperature-dependent light-emitting characteristics of InGaN/GaN diodes

Jun Liu, W.S. Tam, H. Wong, V. Filip

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 598 KB

english, 2009

2

New substrate-triggered ESD protection structures in a 0.18-μm CMOS process without extra mask

Yi Shan, John He, Wen Huang

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.03 MB

english, 2009

3

Drain current saturation at high drain voltage due to pinch off instead of velocity saturation in sub-100 nm metal–oxide–semiconductor transistors

W.S. Lau, Peizhen Yang, Jason Zhiwei Chian, V. Ho, C.H. Loh, S.Y. Siah, L. Chan

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 402 KB

english, 2009

4

RF device package method using Au to Au direct bonding technology

Sangwook Kwon, Jongseok Kim, Gilsu Park, Youngtack Hong, Byeongkwon Ju, Insang Song

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1023 KB

english, 2009

5

Reliability assessment of 1.55-μm vertical cavity surface emitting lasers with tunnel junction using high-temperature aging tests

Keun Ho Rhew, Su Chang Jeon, Dae Hee Lee, Byueng-Su Yoo, Ilgu Yun

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 510 KB

english, 2009

6

A simple estimation of transverse response of high-g accelerometers by a free-drop-bar method

Haifei Bao, Zhaohui Song, Deren Lu, Xinxin Li

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 687 KB

english, 2009

7

Stability of thin film resistors – Prediction and differences base on time-dependent Arrhenius law

Reiner W. Kuehl

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 940 KB

english, 2009

8

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Fang Liu, Guang Meng, Mei Zhao, Jun feng Zhao

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.12 MB

english, 2009

9

Influence of medical sterilization on ACA flip chip joints using conformal coating

Kati Kokko, Hanna Harjunpää, Pekka Heino, Minna Kellomäki

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 419 KB

english, 2009

10

A study on the performance and reliability of magnetostatic actuated RF MEMS switches

Ta-Hsuan Lin, Stephen Paul, Susan Lu, Huitian Lu

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 610 KB

english, 2009

11

Two-stage hot-carrier degradation behavior of 0.18 μm 18 V n-type DEMOS and its recovery effect

Chao Gao, Jun Wang, Lei Wang, Andrew Yap, Hong Li

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 395 KB

english, 2009

12

An investigation of Sn pest in pure Sn and Sn-based solders

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 727 KB

english, 2009

13

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 40 KB

english, 2009

14

Study of stress-induced leakage current (SILC) in HfO2/Dy2O3 high-κ gate stacks on germanium

M.S. Rahman, E.K. Evangelou, I.I. Androulidakis, A. Dimoulas

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 450 KB

english, 2009

15

Physical phenomena affecting performance and reliability of 4H–SiC bipolar junction transistors

Peter G. Muzykov, Robert M. Kennedy, Qingchun (Jon) Zhang, Craig Capell, Al Burk, Anant Agarwal, Tangali S. Sudarshan

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.09 MB

english, 2009

16

Hot-carrier reliability and breakdown characteristics of multi-finger RF MOS transistors

H. Wong, Y. Fu, J.J. Liou, Y. Yue

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 560 KB

english, 2009

17

Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity

V. Born, M. Beck, O. Bosholm, D. Dalleau, S. Glenz, I. Haverkamp, G. Kurz, F. Lange, A. Vest

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 377 KB

english, 2009

18

Calendar

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 49 KB

english, 2009

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Tor version

Z-Library

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски