A reliability model for SAC solder covering isothermal...

Microelectronics Reliability 2010 Vol. 50; Iss. 1

A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Dominik Herkommer, Jeff Punch, Michael Reid
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Volume:
50
Year:
2010
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2009.08.008
File:
PDF, 1.91 MB
english, 2010
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