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Investigation of the heel crack mechanism in Al connections for power electronics modules
Y. Celnikier, L. Benabou, L. Dupont, G. CoqueryVolume:
51
Year:
2011
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2011.01.001
File:
PDF, 1.82 MB
english, 2011