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Volume 51; Issue 5
Main
Microelectronics Reliability
Volume 51; Issue 5
Microelectronics Reliability
Volume 51; Issue 5
1
Structural advantages of rectangular-like channel cross-section on electrical characteristics of silicon nanowire field-effect transistors
Soshi Sato
,
Kuniyuki Kakushima
,
Parhat Ahmet
,
Kenji Ohmori
,
Kenji Natori
,
Keisaku Yamada
,
Hiroshi Iwai
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.27 MB
Your tags:
english, 2011
2
Thermal stability of SiC Schottky diode anode and cathode metalisations after 1000 h at 350 °C
Donagh O’Mahony
,
Russell Duane
,
Tony Campagno
,
Liam Lewis
,
Nicolas Cordero
,
Pleun Maaskant
,
Finbarr Waldron
,
Brian Corbett
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 895 KB
Your tags:
english, 2011
3
Self-consistent design issues for high frequency Cu interconnect reliability incorporating skin effect
Ming Yao
,
Xuliang Zhang
,
Chaoyang Zhao
,
Jianguo Ma
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 777 KB
Your tags:
english, 2011
4
The sensitivity of radiation-induced leakage to STI topology and sidewall doping
Nadia Rezzak
,
Michael L. Alles
,
Ronald D. Schrimpf
,
Sarah Kalemeris
,
Lloyd W. Massengill
,
John Sochacki
,
Hugh J. Barnaby
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.10 MB
Your tags:
english, 2011
5
Material property effects on solder failure analyses
Yeong K. Kim
,
Jin Hyuk Gang
,
Bo-Young Lee
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.15 MB
Your tags:
english, 2011
6
Electrothermomechanical analysis of partially insulated field-effect transistors using hybrid nonlinear finite element method
Ming Yi
,
Wen-Yan Yin
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.92 MB
Your tags:
english, 2011
7
Investigation of the heel crack mechanism in Al connections for power electronics modules
Y. Celnikier
,
L. Benabou
,
L. Dupont
,
G. Coquery
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.82 MB
Your tags:
english, 2011
8
Luminescence properties of mechanically nanoindented ZnSe
Wei-Hung Yau
,
Pai-Chung Tseng
,
Hua-Chiang Wen
,
Chien-Huang Tsai
,
Wu-Ching Chou
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 751 KB
Your tags:
english, 2011
9
Facetting of the self-assembled droplet epitaxial GaAs quantum dot
Ákos Nemcsics
,
Lajos Tóth
,
László Dobos
,
Andrea Stemmann
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 708 KB
Your tags:
english, 2011
10
Integration of analytical techniques in stochastic optimization of microsystem reliability
Xiangdong Xue
,
Chris Bailey
,
Hua Lu
,
Stoyan Stoyanov
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 665 KB
Your tags:
english, 2011
11
Creep behaviour of Sn–3.8Ag–0.7Cu under the effect of electromigration: Experiments and modelling
Fei Su
,
Ronghai Mao
,
Xiaoyan Wang
,
Guangzhou Wang
,
Haiyan Pan
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 469 KB
Your tags:
english, 2011
12
An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method
Haixia Shang
,
Jianxin Gao
,
P. Ian Nicholson
,
Steve Kenny
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.56 MB
Your tags:
english, 2011
13
Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process
Yi-Hsin Weng
,
Hui-Wen Tsai
,
Ming-Dou Ker
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.40 MB
Your tags:
english, 2011
14
Analysis of interconnect capacitance for sub nano CMOS technology using the low dielectric material
Bhavana N. Joshi
,
Yogesh S. Mhaisagar
,
Ashok M. Mahajan
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.10 MB
Your tags:
english, 2011
15
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 37 KB
Your tags:
english, 2011
16
Modeling of enhancement factor of hole mobility for strained silicon under low stress intensity
Hongxia Liu
,
Shulong Wang
,
Yue Hao
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 484 KB
Your tags:
english, 2011
17
Mechanical behavior of solder joints under dynamic four-point impact bending
Tong An
,
Fei Qin
,
Jiangang Li
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.16 MB
Your tags:
english, 2011
18
Cross-cell interference variability aware model of fully planar NAND Flash memory including line edge roughness
Pavel Poliakov
,
Pieter Blomme
,
Miguel Miranda Corbalan
,
Jan Van Houdt
,
Wim Dehaene
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 1.34 MB
Your tags:
english, 2011
19
NBTI reliability on high-k metal-gate SiGe transistor and circuit performances
Jiann-Shiun Yuan
,
Wen-Kuan Yeh
,
Shuyu Chen
,
Chia-Wei Hsu
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 519 KB
Your tags:
english, 2011
20
Temperature and voltage aging effects on electrical conduction mechanism in epoxy-BaTiO3 composite dielectric used in embedded capacitors
Mohammed A. Alam
,
Michael H. Azarian
,
Michael Osterman
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 706 KB
Your tags:
english, 2011
21
Transient current mechanism of lead zirconate titanate capacitors sputtered on La0.65Sr0.35MnO3
Mingzhi Dai
,
Mingming Li
,
Guodong Wu
,
Li Li
,
Huang Jin
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 330 KB
Your tags:
english, 2011
22
Comparison of low-temperature electrical characteristics of gate-all-around nanowire FETs, Fin FETs and fully-depleted SOI FETs
Kiichi Tachi
,
Sylvain Barraud
,
Kuniyuki Kakushima
,
Hiroshi Iwai
,
Sorin Cristoloveanu
,
Thomas Ernst
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 514 KB
Your tags:
english, 2011
23
Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
Asit Kumar Gain
,
Y.C. Chan
,
Winco K.C. Yung
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 2.82 MB
Your tags:
english, 2011
24
A 0.18 μm CMOS linear-in-dB AGC post-amplifier for optical communications
Francisco Aznar
,
Santiago Celma
,
Belén Calvo
Journal:
Microelectronics Reliability
Year:
2011
Language:
english
File:
PDF, 969 KB
Your tags:
english, 2011
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