New conductive thick-film paste based on silver nanopowder...

Microelectronics Reliability 2011 Vol. 51; Iss. 7

New conductive thick-film paste based on silver nanopowder for high power and high temperature applications

Małgorzata Jakubowska, Mateusz Jarosz, Konrad Kiełbasinski, Anna Młożniak
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Volume:
51
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2011.04.015
File:
PDF, 1.01 MB
english, 2011
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