Analysis and suppression of SSN noise coupling between...

IEEE Transactions on Advanced Packaging 2005 / 05 Vol. 28; Iss. 2

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

Junwoo Lee,, Rotaru, M.D., Iyer, M.K., Hyungsoo Kim,, Joungho Kim,
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2005.846932
Date:
May, 2005
File:
PDF, 768 KB
english, 2005
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