Volume 28; Issue 2

IEEE Transactions on Advanced Packaging

Volume 28; Issue 2

1

Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

Heeseok Lee, Young-Seok Hong, Dong Gun Kam, Joungho Kim

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 839 KB

english, 2005

2

Nitride-based flip-chip ITO LEDs

Chang, S.J., Chang, C.S., Su, Y.K., Lee, C.T., Chen, W.S., Shen, C.F., Hsu, Y.P., Shei, S.C., Lo, H.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 785 KB

english, 2005

3

An enhanced transmission line model for conductors with arbitrary cross sections

Maffucci, A., Miano, G., Villone, F.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 525 KB

english, 2005

4

Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach

Pfeiffer, U.R., Chandrasekhar, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 1.76 MB

english, 2005

5

A novel valveless micropump with electrohydrodynamic enhancement for high heat flux cooling

V. Singhal, S. Garimella

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 902 KB

english, 2005

6

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

Junwoo Lee,, Rotaru, M.D., Iyer, M.K., Hyungsoo Kim,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 768 KB

english, 2005

7

Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates

W. Yin, X. Dong

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 1.01 MB

english, 2005

8

System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

Jones, R.E., Ramiah, C., Kamgaing, T., Banerjee, S.K., Chi-Taou Tsai,, Hughes, H.G., De Silva, A.P., Drye, J., Li Li,, Blood, W., Qiang Li,, Vaughan, C.R., Miglore, R., Penunuri, D., Lucero, R., Fr

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 1.70 MB

english, 2005

9

Thermoelectric-powered convective cooling of microprocessors

Yazawa, K., Solbrekken, G.L., Bar-Cohen, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 608 KB

english, 2005

10

Laser-induced surface activation of LTCC materials for chemical metallization

Kordas, K., Pap, A.E., Saavalainen, J., Jantunen, H., Moilanen, P., Haapaniemi, E., Leppavuori, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 981 KB

english, 2005

11

Coupling between microstrip lines with finite width ground plane embedded in thin-film circuits

Ponchak, G.E., Dalton, E., Tentzeris, M.M., Papapolymerou, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 460 KB

english, 2005

12

The creation of compact thermal models of electronic components using model reduction

Celo, D., Xiaoming Guo,, Gunupudi, P.K., Khazaka, R., Walkey, D.J., Smy, T., Nakhla, M.S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 1.05 MB

english, 2005

13

Black-box modeling of passive systems by rational function approximation

Rong Gao,, Mekonnen, Y.S., Beyene, W.T., Schutt-Aine, J.E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 466 KB

english, 2005

14

Optimal chip-package codesign for high-performance DSP

Mehrotra, P., Rao, V., Conte, T.M., Franzon, P.D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 1.03 MB

english, 2005

15

Parametric macromodels of differential drivers and receivers

Stievano, I.S., Maio, I.A., Canavero, F.G., Siviero, C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 462 KB

english, 2005

16

Coupling between differential signals and the dc power-bus in multilayer PCBs

Chen Wang,, Leone, M., Drewniak, J.L., Orlandi, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 825 KB

english, 2005

17

Foreword Contributions From the Eighth Workshop on Signal Propagation on Interconnects

Grabinski, H., Schutt-Aine, J.E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 284 KB

english, 2005

18

An efficient algorithm for sensitivity analysis of nonuniform transmission lines

Gad, E., Nakhla, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 622 KB

english, 2005

19

Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps

Law, C.M.T., Wu, C.M.L., Yu, D.Q., Li, M., Chi, D.Z.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 2.21 MB

english, 2005