Eddy Current Induced Heating for the Solder Reflow of Area Array Packages
Li, Mingyu, Xu, Hongbo, Lee, Shi-Wei Ricky, Kim, Jongmyung, Kim, DaewonVolume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.923385
Date:
May, 2008
File:
PDF, 970 KB
english, 2008