Volume 31; Issue 2

IEEE Transactions on Advanced Packaging

Volume 31; Issue 2

1

A Finite-Element Domain-Decomposition Methodology for Electromagnetic Modeling of Multilayer High-Speed Interconnects

Hong Wu, Cangellaris, A.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.42 MB

english, 2008

2

Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media

Chong-Jin Ong, Boping Wu, Leung Tsang, Xiaoxiong Gu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.42 MB

english, 2008

3

Design and Analysis of Ultra-Miniaturized Meandering Photonic Crystals Delay Lines

Fakharzadeh, M., Ramahi, O.M., Safavi-Naeini, S., Chaudhuri, S.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.27 MB

english, 2008

4

A Transmission-Line Model for Full-Wave Analysis of Mixed-Mode Propagation

Chiariello, A.G., Maffucci, A., Miano, G., Villone, F., Zamboni, W.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 647 KB

english, 2008

5

Effects of ${\hbox{CNT/BaTiO}}_{3}$ Composite Particles Prepared by Mechanical Process on Dielectric Properties of Epoxy Hybrid Films

. Hui Joon Park, . Seung Min Hong, . Sang-soo Lee, . Junkyung Kim, . Min Park

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.35 MB

english, 2008

6

Heat driven cooling of portable electronics using thermoelectric technology

Solbrekken, G.L., Yazawa, K., Bar-Cohen, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 948 KB

english, 2008

7

Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port Correction

Kai-Bin Wu,, Guang-Hwa Shiue,, Wei-Da Guo,, Chien-Min Lin,, Ruey-Beei Wu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.31 MB

english, 2008

8

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias

Oo, Zaw Zaw, Liu, En-Xiao, Li, Er-Ping, Wei, Xingchang, Zhang, Yaojiang, Tan, Mark, Li, Le-Wei Joshua, Vahldieck, RÜdiger

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.05 MB

english, 2008

9

New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-Flex

Baik-Woo Lee,, Jui-Yun Tsai,, Hotae Jin,, Yoon, C.K., Tummala, R.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 3.75 MB

english, 2008

10

Eddy Current Induced Heating for the Solder Reflow of Area Array Packages

Li, Mingyu, Xu, Hongbo, Lee, Shi-Wei Ricky, Kim, Jongmyung, Kim, Daewon

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 970 KB

english, 2008

11

A Fast Computation Method in Frequency Domain for Power Ground Plane Impedance Calculation Using the Mobius Transform

Youngsuk Suh,, Pinping Sun,, Insung Kim,, Jaesung Song,, Deukhyoun Heo,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 553 KB

english, 2008

12

Development of Stretch Solder Interconnections for Wafer Level Packaging

Rajoo, R., Lim, S. S., Wong, E. H., Hnin, W. Y., Seah, S. K. W., Tay, A. A. O., Iyer, Mahadevan, Tummala, Rao R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.90 MB

english, 2008

13

Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging

Tan, C.W., Chan, Y.C., Leung, N.W., Liu, H.D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 5.13 MB

english, 2008

14

622-Mb/s Bidirectional SFP Optical Transceiver Using an Integrated WDM Optical Subassembly

Hyun-Jae Yoon,, Jeong-Geon Kim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.84 MB

english, 2008

15

An Ultra-Compact Planar Bandpass Filter With Open-Ground Spiral for Wireless Application

Kaixue Ma,, Kiat Seng Yeo,, Jian-Guo Ma,, Manh Anh Do,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 854 KB

english, 2008

16

Eye-Pattern Design for High-Speed Differential Links Using Extended Passive Equalization

Ki Jin Han,, Hayato Takeuchi,, Swaminathan, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.34 MB

english, 2008

17

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

Ho-Gyeong Yun,, Kwang-Seong Choi,, Yong-Hwan Kwon,, Joong-Seon Choe,, Jong-Tae Moon,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.41 MB

english, 2008

18

Microchip Self-Assembly on a Substrate Using Plasma Treatment

Chang, Chia-Shou, Uang, Ruoh-Huey, Wu, Enboa

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.13 MB

english, 2008

19

A Micromachined Chip-to-Board Interconnect System Using Electroplating Bonding Technology

Yeun-Ho Joung,, Allen, M.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.41 MB

english, 2008

20

Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors

Muthana, P., Srinivasan, K., Engin, A.E., Swaminathan, M., Tummala, R., Sundaram, V., Wiedenman, B., Amey, D.I., Dietz, K.H., Banerji, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.18 MB

english, 2008

21

40-Gb/s Package Design Using Wire-Bonded Plastic Ball Grid Array

Dong Gun Kam,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.94 MB

english, 2008

22

Thermal Aging Reliability of Package-Level Polymer Optical Waveguides

Hegde, S.G., Sitaraman, S.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 790 KB

english, 2008