Packaging and Assembly of 3-D Silicon Stacked Module for...

IEEE Transactions on Advanced Packaging 2008 / 08 Vol. 31; Iss. 3

Packaging and Assembly of 3-D Silicon Stacked Module for Image Sensor Application

Yoon, Seung Wook, Ganesh, V. P., Lim, Samuel Yak Long, Kripesh, Vaidyanathan
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.927826
Date:
August, 2008
File:
PDF, 2.22 MB
english, 2008
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