Higher density using diffusion patterned vias and fine-line...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1994 / Sept. Vol. 17; Iss. 3

Higher density using diffusion patterned vias and fine-line printing

Bender, D.K., Ferreira, A.M.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.311760
Date:
January, 1994
File:
PDF, 555 KB
english, 1994
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