Volume 17; Issue 3

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IEEE Transactions on Components Packaging and Manufacturing...
Volume 17; Issue 3

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volume 17; Issue 3

1

Design and scaling of a SONOS multidielectric device for nonvolatile memory applications

French, M.L., Chun-Yu Chen, Sathianathan, H., White, M.H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 809 KB

english, 1994

2

Form and capacitance of parallel-plate capacitors

Nishiyama, H., Nakamura, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 605 KB

english, 1994

3

A fully integrated planar toroidal inductor with a micromachined nickel-iron magnetic bar

Ahn, C.H., Kim, Y.J., Allen, M.G.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 768 KB

english, 1994

4

The model of interaction between arc and AgMeO contact materials

Ming Sun,, Qiping Wang,, Lindmayer, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 444 KB

english, 1994

5

Performance of thin-film chip resistors

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 652 KB

english, 1994

6

Thermal component models for electrothermal network simulation

Hefner, A.R., Blackburn, D.L.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 1.25 MB

english, 1994

7

UV curable coatings for electronic components

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 629 KB

english, 1994

8

Designing a reliability demonstration test on a lithography expose tool using Bayesian techniques

Villacourt, M., Mahaney, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 425 KB

english, 1994

9

MNOS memory technology with oxynitride thin films

Kapoor, V.J., Turi, R.A., Xu, D., Bailey, R.S.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 634 KB

english, 1994

10

1/f noise and its coherence as a diagnostic tool for quality assessment of potentiometers

Vandamme, E.P., Vandamme, L.K.J.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 840 KB

english, 1994

11

A multilayer ceramic series-connected capacitive-resistive device for impedance matching of high-frequency digital signal buses

Helms, B.E., de Neuf, J.B., Canner, J.P.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 443 KB

english, 1994

12

Ultra-high impact resistant digital data recorder for missile flight testing

Hill-Lindsay, J.W., Yuen, J.T.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 535 KB

english, 1994

13

1-Mb memory chip using giant magnetoresistive memory cells

Brown, J.L., Pohm, A.V.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 636 KB

english, 1994

14

Higher density using diffusion patterned vias and fine-line printing

Bender, D.K., Ferreira, A.M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 555 KB

english, 1994

15

Ceramic multicomponent modules: a new approach to miniaturization

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 412 KB

english, 1994

16

Computer-aided design of passive multilayer components using electromagnetic field computation

Morweiser, W., Meunier, G., Salze, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 703 KB

english, 1994

17

Thermal rating characteristics of UHF power capacitors

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 496 KB

english, 1994

18

Squeegee deformation study in the stencil printing of solder pastes

Mannan, S.H., Ekere, N.N., Ismail, I., Lo, E.K.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 607 KB

english, 1994

19

Thermal performance of an integral immersion cooled multichip module package

Nelson, R.D., Sommerfeldt, S., Bar-Cohen, A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 965 KB

english, 1994

20

A new reliability test for multilayer ceramic capacitors

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 380 KB

english, 1994

21

Chip manufacturing: matching production plan with customer requirements

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 513 KB

english, 1994

22

Test chips, test systems, and thermal test data for multichip modules in the ESPRIT-APACHIP project

O'Mathuna, S.C., Fromont, T., Koschnick, W., O'Connor, L.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 1.24 MB

english, 1994

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