Scan-Based Testing of Post-Bond Silicon Interposer...

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2014 / 9 Vol. 33; Iss. 9

Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs

Wang, Ran, Chakrabarty, Krishnendu, Eklow, Bill
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Volume:
33
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/tcad.2014.2331336
Date:
September, 2014
File:
PDF, 3.30 MB
english, 2014
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