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Electron Attachment: A New Approach to ${\rm H} _{2}$ Fluxless Solder Reflow for Wafer Bumping
Dong, C. Christine, Patrick, Richard E., Karwacki, Eugene J.Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2007.901581
Date:
August, 2007
File:
PDF, 2.48 MB
english, 2007