Novel Ceramic Composite Substrates for High-Density and...

IEEE Transactions on Advanced Packaging 2007 / 11 Vol. 30; Iss. 4

Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging

Kumbhat, N., Raj, P.M., Pucha, R.V., Jui-Yun Tsai,, Atmur, S., Bongio, E., Sitaraman, S.K., Tummala, R.R.
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2007.908027
Date:
November, 2007
File:
PDF, 2.16 MB
english, 2007
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