Volume 30; Issue 4

IEEE Transactions on Advanced Packaging

Volume 30; Issue 4

1

Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method

Ting-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, Drewniak, J.L., Tzong-Lin Wu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.11 MB

english, 2007

2

Highly Reliable High-Brightness GaN-Based Flip Chip LEDs

Chang, S.J., Chen, W.S., Shei, S.C., Ko, T.K., Shen, C.F., Hsu, Y.P., Chang, C.S., Tsai, J.M., Lai, W.C., Lin, A.J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 812 KB

english, 2007

3

Fabrication of Precise Die Edges for Micro-Optical and MEMS Applications

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.57 MB

english, 2007

4

A Study of Parylene C Polymer Deposition Inside Microscale Gaps

Ramachandran, A., Junk, M., Koch, K.P., Hoffmann, K.-P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.70 MB

english, 2007

5

A Novel Wafer-Level Hermetic Packaging for MEMS Devices

Chingfu Tsou,, Hungchung Li,, Hsing-Cheng Chang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.77 MB

english, 2007

6

Suppression of EMI and Electromagnetic Noise in Packages Using Embedded Capacitance and Miniaturized Electromagnetic Bandgap Structures With High-k Dielectrics

Mohajer-Iravani, B., Ramahi, O.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.78 MB

english, 2007

7

Stability, Causality, and Passivity in Electrical Interconnect Models

Triverio, P., Grivet-Talocia, S., Nakhla, M.S., Canavero, F.G., Achar, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 880 KB

english, 2007

8

Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package

P. Muthana, A. Engin, M. Swaminathan, R. Tummala, V. Sundaram, B. Wiedenman, D. Amey, K. Dietz, S. Banerji

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.48 MB

english, 2007

9

Quilt Packaging: High-Density, High-Speed Interchip Communications

Bernstein, G.H., Qing Liu,, Minjun Yan,, Zhuowen Sun,, Kopp, D., Porod, W., Snider, G., Fay, P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.03 MB

english, 2007

10

Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging

Kumbhat, N., Raj, P.M., Pucha, R.V., Jui-Yun Tsai,, Atmur, S., Bongio, E., Sitaraman, S.K., Tummala, R.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.16 MB

english, 2007

11

An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2—Applications in Fatigue Reliability Predictions for SnPb and Lead-Free Solders

Ghorbani, H.R., Spelt, J.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.23 MB

english, 2007

12

Model Order Reduction With Parametric Port Formulation

Min Ma,, Khazaka, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 721 KB

english, 2007

13

Analytical Solutions for Interconnect Stress in Board Level Drop Impact

Wong, E.H., Yiu-Wing Mai,, Seah, S.K.W., Kian-Meng Lim,, Thiam Beng Lim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 982 KB

english, 2007

14

Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material

Shrivastava, S.K., Sammakia, B.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.39 MB

english, 2007

15

Experimental and Numerical Studies of Warpages of ACF-Bonded COG Packages Induced From Manufacturing and Thermal Cycling

Ming-Yi Tsai,, Chen-Yu Huang,, Chih-Yao Chiang,, Wen-Chin Chen,, Sheng-Shu Yang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.53 MB

english, 2007

16

An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 1—Development and Verification

Ghorbani, H.R., Spelt, J.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 626 KB

english, 2007

17

A Novel Bonding Method for Ionic Wafers

Howlader, M.M.R., Suga, T., Kim, M.J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.47 MB

english, 2007

18

A Hybrid Evolutionary Modeling/Optimization Technique for Collector-Up/Down HBTs in RFIC and OEIC Modules

Hsien-Cheng Tseng,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 575 KB

english, 2007

19

Electrical and Thermal Cosimulation of GaAs Interconnects

Wartenberg, S.A., Gang Zhao,, Qing Hou Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 618 KB

english, 2007

20

Evaluation of Packaging Effect on MEMS Performance: Simulation and Experimental Study

Lishchynska, M., O'Mahony, C., Slattery, O., Wittler, O., Walter, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.74 MB

english, 2007

21

Hygrothermal Failures From Small Defects in Lead-Free Solder Reflowed Electronic Packages

Lam, D.C.C., Jun Wang,, Fan Yang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 402 KB

english, 2007

22

Passive Order Reduction for RLC Circuits With Delay Elements

Wenliang Tseng,, Changzhong Chen,, Gad, E., Nakhla, M., Achar, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.03 MB

english, 2007

23

Extension of an Efficient Moment-Methods-Based Full-Wave Layered Interconnect Simulator to Finite-Width Expansion Functions

Zhaohui Zhu,, Qiang Li,, Xing Wang,, Dvorak, S.L., Prince, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 818 KB

english, 2007

24

Electromagnetic-Thermal Characterization of on On-Chip Coupled (A)Symmetrical Interconnects

Wen-Yan Yin,, Kai Kang,, Jun-Fa Mao,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.62 MB

english, 2007

25

Effect of Gold Stud Bump Topology on Reliability of Flip Chip on Flex Interconnects

Majeed, B., Paul, I., Razeeb, K.M., Barton, J., O'Mathuna, S.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 4.38 MB

english, 2007

26

High-Density Solder Bump Interconnect for MEMS Hybrid Integration

Basavanhally, N., Lopez, D., Aksyuk, V., Ramsey, D., Bower, E., Cirelli, R., Ferry, E., Frahm, R., Gates, J., Klemens, F., Lai, W., Low Yee,, Mansfield, W., Chien-Shing Pai,, Papazian, R., Pardo, F.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.64 MB

english, 2007