Fabrication of low dielectric constant materials for ULSI...

IEEE Electron Device Letters 1998 / 11 Vol. 19; Iss. 11

Fabrication of low dielectric constant materials for ULSI multilevel interconnection by plasma ion implantation

Shu Qin,, Yuanzhong Zhou,, Chung Chan,, Chu, P.K.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
19
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/55.728899
Date:
November, 1998
File:
PDF, 58 KB
english, 1998
Conversion to is in progress
Conversion to is failed