A 3-D stacked chip packaging solution for miniaturized massively parallel processing
Lea, R.M., Jalowiecki, I.P., Boughton, D.K., Yamaguchi, J.S., Pepe, A.A., Ozguz, V.H., Carson, J.C.Volume:
22
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.784496
Date:
January, 1999
File:
PDF, 1.41 MB
english, 1999