Volume 22; Issue 3

IEEE Transactions on Advanced Packaging

Volume 22; Issue 3

1

Modeling and electrical analysis of seamless high off-chip connectivity (SHOCC) interconnects

Afonso, S., Schaper, L.W., Parkerson, J.P., Brown, W.D., Ang, S., Naseem, H.A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 459 KB

english, 1999

2

Mechatronics for automotive and industrial applications

Triantafyllou, M., Neumann, K.-T., Reichl, H., Ansorge, F., Grosser, V., Becker, K.-F., Schmidt, E., Maier, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.02 MB

english, 1999

3

Electrical characterization of integrated circuit molding compound

Green, C.C., Seligman, J.M., Prince, J.L., Virga, K.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 186 KB

english, 1999

4

Power distribution system design methodology and capacitor selection for modern CMOS technology

Smith, L.D., Anderson, R.E., Forehand, D.W., Pelc, T.J., Roy, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 198 KB

english, 1999

5

Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 382 KB

english, 1999

6

Electrical evaluation of flip-chip package alternatives for next generation microprocessors

Darnauer, J., Chengson, D., Schmidt, B., Priest, E., Hanson, D.A., Petefish, W.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 983 KB

english, 1999

7

Ten-channel optical transmitter module for sub-system interconnection operating at λ=1.3 μm up to 12.5 Gbit/s

Bostica, B., Burzio, M., Delpiano, F., Pellegrino, P., Pesando, L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 639 KB

english, 1999

8

A 3-D stacked chip packaging solution for miniaturized massively parallel processing

Lea, R.M., Jalowiecki, I.P., Boughton, D.K., Yamaguchi, J.S., Pepe, A.A., Ozguz, V.H., Carson, J.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.41 MB

english, 1999

9

High reliability, high density, low cost packaging systems for matrix systems for matrix BGA and CSP by vacuum printing encapsulation systems (VPES)

Okuno, A., Fujita, N., Ishikawa, Y.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.16 MB

english, 1999

10

Contributions from the seventh topical meeting on electrical performance of electronic packaging

Deutsch, A., Swaminathan, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 77 KB

english, 1999

11

Stress-buffer and passivation processes for Si and GaAs IC's and passive components using photosensitive BCB: process technology and reliability data

Ganrou, P.E., Rogers, W.B., Scheck, D.M., Strandjord, A.J.G., Ida, Y., Ohba, K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 716 KB

english, 1999

12

A new discrete transmission line model for passive model order reduction and macromodeling of high-speed interconnections

Cangellaris, A.C., Pasha, S., Prince, J.L., Celik, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 281 KB

english, 1999

13

Correction to "Frequency response characteristics of reference plane effective inductance and resistance"

Xuebing Xie,, Prince, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 20 KB

english, 1999

14

Transient two-dimensional thermal analysis of electronic packages by the boundary element method

Guven, I., Cho Lik Chan,, Madenci, E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 357 KB

english, 1999

15

Design and characteristics of a newly developed cavity-up plastic and ceramic laminated thin BGA package

Asai, H., Yano, K., Iyogi, K., Iwase, N., Fujiwara, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 510 KB

english, 1999

16

Electrical design and simulation of high density printed circuit boards

Swirbel, T., Naujoks, A., Watkins, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 485 KB

english, 1999

17

Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology

Itagaki, M., Amami, K., Tomura, Y., Yuhaku, S., Ishimaru, Y., Bessho, Y., Eda, K., Ishida, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 488 KB

english, 1999

18

Modeling of power distribution systems for high-performance microprocessors

Herrell, D.J., Beker, B.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 229 KB

english, 1999

19

Accurate power supply and ground plane pair models [for MCMs]

Wu, H.H., Meyer, J.W., Keunmyung Lee,, Barber, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 263 KB

english, 1999

20

Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging

Gonzalez, C.G., Wessel, R.A., Padlewski, S.A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 790 KB

english, 1999

21

A compact MU-interface, 2.5-Gb/s optical transmitter module with LD-driver IC embedded in L-shaped wiring substrate

Ishitsuka, F., Iwasaki, N., Hirose, M., Yanagibashi, M., Ichino, H., Ando, Y.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 766 KB

english, 1999

22

Spiral transmission-line baluns for RF multichip module packages

Yoon, Y.J., Yicheng Lu,, Frye, R.C., Smith, P.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 177 KB

english, 1999

23

Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

Jaeyong Jeong,, Seungki Nam,, Shin, Y.S., Kim, Y.S., Jichai Jeong,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 200 KB

english, 1999

24

Efficient computation of interconnect capacitances using the domain decomposition approach

Veremey, V.V., Mittra, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 412 KB

english, 1999

25

A novel high performance adhesion enhancing Zn-Cr leadframe coating for popcorn prevention

Lee, C., Hoesler, W., Cerva, H., von Criegern, R., Parthasarathi, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 380 KB

english, 1999

26

International conference on multichip modules and high density packaging

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 13 KB

english, 1999

27

Contribution of resonance to ground bounce in lossy thin film planes

Pannala, S., Bandyopadhyay, J., Swaminathan, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 357 KB

english, 1999

28

Moisture sensitivity characterization of build-up ball grid array substrates

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.73 MB

english, 1999

29

RF/microwave characterization of multilayer ceramic-based MCM technology

Sutono, A., Pham, A.-V.H., Laskar, J., Smith, W.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 298 KB

english, 1999

30

Thermal management for multifunctional structures

S. Rawal, D. Barnett, D. Martin

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 957 KB

english, 1999

31

Frequency-dependent crosstalk simulation for on-chip interconnections

Deutsch, A., Smith, H.H., Surovic, C.W., Kopcsay, G.V., Webber, D.A., Coteus, P.W., Katopis, G.A., Becker, W.D., Dansky, A.H., Sai-Halasz, G.A., Restle, P.J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.45 MB

english, 1999

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