Ceramic multicomponent modules: a new approach to...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1994 / Sept. Vol. 17; Iss. 3

Ceramic multicomponent modules: a new approach to miniaturization

Keizer, P.H.M.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.311739
Date:
January, 1994
File:
PDF, 412 KB
english, 1994
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