Multiple-chip precise self-aligned assembly for hybrid...

IEEE Transactions on Advanced Packaging 2001 / Nov. Vol. 24; Iss. 2

Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps

Sasaki, J., Itoh, M., Tamanuki, T., Hatakeyama, H., Kitamura, S., Shimoda, T., Kato, T.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.982846
Date:
January, 2001
File:
PDF, 185 KB
english, 2001
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