A Packaging Solution for Optically Testing Wire-Bonded...

IEEE Transactions on Advanced Packaging 2008 / 08 Vol. 31; Iss. 3

A Packaging Solution for Optically Testing Wire-Bonded Chips

Tosi, Alberto, Stellari, Franco, Zappa, Franco, Song, Peilin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.927823
Date:
August, 2008
File:
PDF, 979 KB
english, 2008
Conversion to is in progress
Conversion to is failed