High-yield flip-chip bonding and packaging of low-threshold...

IEEE Transactions on Components and Packaging Technologies 2003 / 09 Vol. 26; Iss. 3

High-yield flip-chip bonding and packaging of low-threshold VCSEL arrays on sapphire substrates

Liu, J.J., Anderson Olver, K., Taysing-Lara, M., Taylor, T., Chang, W., Horst, S.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2003.817645
Date:
September, 2003
File:
PDF, 1.45 MB
english, 2003
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