Volume 26; Issue 3

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IEEE Transactions on Components and Packaging Technologies
Volume 26; Issue 3

IEEE Transactions on Components and Packaging Technologies

Volume 26; Issue 3

1

Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint

Li, G.Y., Chen, B.L.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 926 KB

english, 2003

2

Molecular basis of the interphase dielectric properties of microelectronic and optoelectronic packaging materials

Todd, M.G., Shi, F.G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 327 KB

english, 2003

3

High quality LTCC resonator for voltage-controlled oscillator

Prochazka, T., Fischer, M., Gruber, B., Manner, R., Matz, R., Walter, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 687 KB

english, 2003

4

Printed microinductors on flexible substrates for power applications

Brandon, E.J., Wesseling, E.E., Chang, V., Kuhn, W.B.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 511 KB

english, 2003

5

Heat transfer analysis and simplified thermal resistance modeling of linear motor driven stages for SMT applications

. Changsoo Jang, . Jong Young Kim, . Yung Joon Kim, . Jae Ok Kim

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.20 MB

english, 2003

6

Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesive

Murray, S., Hillman, C., Pecht, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 557 KB

english, 2003

7

Lead-free soldering in the Japanese electronics industry

Fukuda, Y., Pecht, M.G., Fukuda, K., Fukuda, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 332 KB

english, 2003

8

A life consumption monitoring methodology for electronic systems

Ramakrishnan, A., Pecht, M.G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.88 MB

english, 2003

9

High frequency cable connector for twisted pair cables

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 627 KB

english, 2003

10

β-Helix: A lithography-based compliant off-chip interconnect

Qi Zhu,, Lunyu Ma,, Sitaraman, S.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.24 MB

english, 2003

11

High-yield flip-chip bonding and packaging of low-threshold VCSEL arrays on sapphire substrates

Liu, J.J., Anderson Olver, K., Taysing-Lara, M., Taylor, T., Chang, W., Horst, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.45 MB

english, 2003

12

Determining the impact resistance of electrically conductive adhesives using a falling wedge test

Shuangyan Xu,, Dillard, D.A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 981 KB

english, 2003

13

Disk-shaped miniature heat pipe (DMHP) with radiating micro grooves for a to can laser diode package

Hsin-Tang Chien,, Da-Sheng Lee,, Pei-Pei Ding,, Shiu-Lin Chiu,, Ping-Hei Chen,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 532 KB

english, 2003

14

Are U.S. jobs moving to China?

Donahoe, D.N., Pecht, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 246 KB

english, 2003

15

Heat transfer and residual stress modeling of a diamond film heat sink for high power laser diodes

Labudovic, M., Burka, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 3.20 MB

english, 2003

16

Compact conduction model of ball grid array packages

Refai-Ahmed, G., Karimanal, K.V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 390 KB

english, 2003

17

Humidity and reflow resistance of flip chip on foil assemblies with conductive adhesive joints

de Vries, J., Janssen, E.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 617 KB

english, 2003

18

Active fiber-solder-ferrule alignment method for high-performance opto-electronic device packaging

Yih-Tun Tseng,, Yung-Ching Chang,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.24 MB

english, 2003

19

Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks

Weilin Qu,, Mudawar, I.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 704 KB

english, 2003

20

Failure mechanism study of anisotropic conductive film (ACF) packages

Mercado, L.L., White, J., Sarihan, V., Lee, T.T.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 965 KB

english, 2003

21

The microstructure investigation of flip-chip laser diode bonding on silicon substrate by using indium-gold solder

Chien-Chih Liu,, Yen-Kuang Lin,, Mau-Phon Houng,, Yeong-Her Wang,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.29 MB

english, 2003

22

Numerical simulation of stress evolution during electromigration in IC interconnect lines

Hua Ye,, Basaran, C., Hopkins, D.C.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 835 KB

english, 2003

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