Analytical Solutions for Interconnect Stress in Board Level...

IEEE Transactions on Advanced Packaging 2007 / 11 Vol. 30; Iss. 4

Analytical Solutions for Interconnect Stress in Board Level Drop Impact

Wong, E.H., Yiu-Wing Mai,, Seah, S.K.W., Kian-Meng Lim,, Thiam Beng Lim,
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2007.898599
Date:
November, 2007
File:
PDF, 982 KB
english, 2007
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