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Transient Stress Distributions in NCF-Bonded COG Packages due to Moisture Diffusion
Tsai, M. Y., Wu, C. Y., Huang, C. Y., Yang, S. S.Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.927844
Date:
August, 2008
File:
PDF, 1.02 MB
english, 2008