IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1994 / Sept. Vol. 17; Iss. 3
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Squeegee deformation study in the stencil printing of solder pastes
Mannan, S.H., Ekere, N.N., Ismail, I., Lo, E.K.Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.311758
Date:
January, 1994
File:
PDF, 607 KB
english, 1994