Stress-buffer and passivation processes for Si and GaAs...

IEEE Transactions on Advanced Packaging 1999 / Aug. Vol. 22; Iss. 3

Stress-buffer and passivation processes for Si and GaAs IC's and passive components using photosensitive BCB: process technology and reliability data

Ganrou, P.E., Rogers, W.B., Scheck, D.M., Strandjord, A.J.G., Ida, Y., Ohba, K.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.784503
Date:
January, 1999
File:
PDF, 716 KB
english, 1999
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