![](/img/cover-not-exists.png)
Active fiber-solder-ferrule alignment method for high-performance opto-electronic device packaging
Yih-Tun Tseng,, Yung-Ching Chang,Volume:
26
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2003.817644
Date:
September, 2003
File:
PDF, 1.24 MB
english, 2003