High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit Packages
Kim, Heungkyu, Eo, YungseonVolume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.2005472
Date:
November, 2008
File:
PDF, 1.75 MB
english, 2008