Volume 31; Issue 4

IEEE Transactions on Advanced Packaging

Volume 31; Issue 4

1

Development of a Broadband Coplanar Waveguide-to-Microstrip Transition With Vias

Zhen Zhou, Melde, K.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1004 KB

english, 2008

2

Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications

Dangel, Roger, Berger, Christoph, Beyeler, RenÃ, Dellmann, Laurent, Gmur, Max, Hamelin, RÃgis, Horst, Folkert, Lamprecht, Tobias, Morf, Thomas, Oggioni, Stefano, Spreafico, Mauro, Offrein, Bert Jan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.61 MB

english, 2008

3

Modal Vector Fitting: A Tool For Generating Rational Models of High Accuracy With Arbitrary Terminal Conditions

Gustavsen, B., Heitz, C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 507 KB

english, 2008

4

Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects

Maffucci, Antonio, Miano, Giovanni, Villone, Fabio

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 588 KB

english, 2008

5

Power Handling Capability of Substrate Integrated Waveguide Interconnects and Related Transmission Line Systems

Yu Jian Cheng,, Ke Wu,, Wei Hong,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 967 KB

english, 2008

6

Karlsson, Magnus, Hakansson, PÄr, Gong, Shaofang

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 610 KB

english, 2008

7

Antonini, Giulio, Ruehli, Albert E., Yang, Chuanyi

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.84 MB

english, 2008

8

Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees

Yun, Ho-Gyeong, Choi, Kwang-Seong, Kwon, Yong-Hwan, Choe, Joong-Seon, Moon, Jong-Tae

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 987 KB

english, 2008

9

Locally-Stable Macromodels of Integrated Digital Devices for Multimedia Applications

Stievano, I.S., Siviero, C., Maio, I.A., Canavero, F.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 650 KB

english, 2008

10

Improving Behavioral IO Buffer Modeling Based on IBIS

Varma, Ambrish K., Steer, Michael, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.45 MB

english, 2008

11

A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Jianfang Zhu,, Dan Jiao,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.21 MB

english, 2008

12

A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip Lines

Kyoungho Lee,, Hyun-Bae Lee,, Hae-Kang Jung,, Jae-Yoon Sim,, Hong-June Park,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.55 MB

english, 2008

13

Interchannel Crosstalk Analysis in Parallel Optical Receiver up to 10 GHz

Park, Sang Hyun, Park, Chul Soon, Karppinen, Mikko, Tanskanen, Antti, Kautio, Kari, Karioja, Pentti

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.69 MB

english, 2008

14

Multiple Edge Responses for Fast and Accurate System Simulations

Ren, JiHong, Oh, Kyung Suk

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.03 MB

english, 2008

15

Frequency Domain Analysis of Transmission Zeroes on High-Speed Interconnects in the Presence of an Orthogonal Metal Grid Underlayer

Quere, Yves, Le Gouguec, Thierry, Martin, Pierre-Marie, Le Berre, Denis, Huret, Fabrice

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 847 KB

english, 2008

16

Design and Manufacturing of Stretchable High-Frequency Interconnects

Huyghe, B., Rogier, H., Vanfleteren, J., Axisa, F.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 950 KB

english, 2008

17

A Comparative Study of Passivity Enforcement Schemes for Linear Lumped Macromodels

Grivet-Talocia, S., Ubolli, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.26 MB

english, 2008

18

Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Chandrasekar, Karthik, Wilson, John, Erickson, Evan, Feng, Zhiping, Xu, Jian, Mick, Stephen, Franzon, Paul

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

19

Full-Wave Analysis of Large-Scale Interconnects Using the Multilevel UV Method With the Sparse Matrix Iterative Approach (SMIA)

Ong, Chong-Jin, Tsang, Leung

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.03 MB

english, 2008

20

Integrated Process-Aging Modeling Methodology for Flip Chip on Flex Interconnections With Nonconductive Adhesives

Zhang, Xiaowu, Wong, E. H., Rajoo, Ranjan, Iyer, Mahadevan K., Caers, J. F. J. M., Zhao, X. J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 980 KB

english, 2008

21

Accurate System Voltage and Timing Margin Simulation in High-Speed I/O System Designs

Kyung Suk Oh,, Lambrecht, F., Sam Chang,, Qi Lin,, Jihong Ren,, Chuck Yuan,, Zerbe, J., Stojanovic, V.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.37 MB

english, 2008

22

High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit Packages

Kim, Heungkyu, Eo, Yungseon

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.75 MB

english, 2008

23

A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Dan Jiao,, Jianfang Zhu,, Chakravarty, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 804 KB

english, 2008

24

Controlled Intersymbol Interference Design Techniques of Conventional Interconnect Systems for Data Rates Beyond 20 Gbps

Beyene, W.T., Amirkhany, A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.09 MB

english, 2008

25

Comprehensive Electromagnetic Modeling of On-Chip Switching Noise Generation and Coupling

Ihm, Jae-Yong, Chung, In Jae, Manetas, Giorgos, Cangellaris, Andreas

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.31 MB

english, 2008

26

Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

Canavero, Flavio, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 303 KB

english, 2008

27

Full-Field 3-D Flip-Chip Solder Bumps Measurement Using DLP-Based Phase Shifting Technique

Yen, Hsu-Nan, Tsai, Du-Ming, Feng, Shang-Kai

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.14 MB

english, 2008