On Effective Through-Silicon Via Repair for 3-D-Stacked ICs

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2013 / 04 Vol. 32; Iss. 4

On Effective Through-Silicon Via Repair for 3-D-Stacked ICs

Jiang, Li, Xu, Qiang, Eklow, Bill
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/tcad.2012.2228742
Date:
April, 2013
File:
PDF, 9.67 MB
english, 2013
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