Advances in Vapor Pressure Modeling for Electronic...

IEEE Transactions on Advanced Packaging 2006 / 11 Vol. 29; Iss. 4

Advances in Vapor Pressure Modeling for Electronic Packaging

Wong, E. H., Koh, S. W., Lee, K. H., Lim, Kian-Meng, Lim, Thiam Beng, Mai, Yiu-Wing
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.879423
Date:
November, 2006
File:
PDF, 908 KB
english, 2006
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