Volume 29; Issue 4

IEEE Transactions on Advanced Packaging

Volume 29; Issue 4

1

A Study of Permittivity Measurement Reproducibility Utilizing the Agilent 4291B

Hill, M.J., Wojewoda, L.E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 406 KB

english, 2006

2

Thermosonic Flip Chip Interconnection Using Electroplated Copper Column Arrays

Gao, S., Holmes, A. S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 3.75 MB

english, 2006

3

Design and Characterization of Purely Textile Patch Antennas

Locher, Ivo, Klemm, Maciej, Kirstein, Tnde, Trster, Gerhard

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 2.84 MB

english, 2006

4

A Fully Embedded 60-GHz Novel BPF for LTCC System-in-Package Applications

Lee, Young Chul, Park, Chul Soon

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 1.27 MB

english, 2006

5

High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA

Sun, Xiao, Dupuis, Olivier, Linten, Dimitri, Carchon, Geert, Soussan, Philippe, Decoutere, Stefaan, De Raedt, Walter, Beyne, Eric

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 2.52 MB

english, 2006

6

Pan, Jianbiao, Pafchek, Robert M., Judd, Frank F., Baxter, Jason B.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 862 KB

english, 2006

7

Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle Parameters

Qi, Yan, Ghorbani, Hamid R., Spelt, Jan K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 1.16 MB

english, 2006

8

Advances in Vapor Pressure Modeling for Electronic Packaging

Wong, E. H., Koh, S. W., Lee, K. H., Lim, Kian-Meng, Lim, Thiam Beng, Mai, Yiu-Wing

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 908 KB

english, 2006

9

Scalable Model of On-Wafer Interconnects for High-Speed CMOS ICs

Shi, Xiaomeng, Yeo, Kiat Seng, Ma, Jian-Guo, Do, Manh Anh, Li, Erping

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 736 KB

english, 2006

10

Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material Curable in Air

So, Ying-Hung, Stark, Edmund J., Li, Yongfu, Kisting, Scott, Achen, Albert, Baranek, Kayla, Scheck, Daniel, Hetzner, Jack, Folkenroth, Jason J., Tpper, Michael, Baumgartner, T

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 3.96 MB

english, 2006

11

Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Chan, Y. C., Tan, S. C., Lui, Nelson S. M., Tan, C. W.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 1.71 MB

english, 2006

12

Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallurgy Layer

Huang, Annie T., Chou, Chung-Kuang, Chen, Chih

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 3.05 MB

english, 2006

13

Three-Optical-Port Module for Monolithic Optical Gate Integrated With Photodiode and Electroabsorption Modulator

Yoshino, Kaoru, Yoshimatsu, Toshihide, Kodama, Satoshi, Ito, Hiroshi

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 1.23 MB

english, 2006

14

Fluidic Assembly of Optical Components

Avital, Alon, Zussman, Eyal

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 891 KB

english, 2006

15

A Time-Domain Approach for Extracting Broadband Macro- $\pi$ Models of Differential Via Holes

Wang, Chen-Chao, Kuo, Chih-Wen, Kuo, Chun-Chih, Wu, Tzong-Lin

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 982 KB

english, 2006

16

Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, Cemal, Wen, Yujun

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 494 KB

english, 2006

17

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

Chong, Desmond Y. R., Lim, B. K., Rebibis, Kenneth J., Pan, S. J., Sivalingam, K., Kapoor, R., Sun, Anthony Y. S., Tan, H. B.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 1.70 MB

english, 2006

18

Effect of Current Crowding on Frequency Response of a Stepped Planar RF Transmission-Line Lowpass Filter for Power Electronics

Campbell, Colin Kydd, van Wyk, Jacobus Daniel, Chen, Rengang

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 623 KB

english, 2006

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