The package integration of rf-mems switch and control ic...

IEEE Transactions on Advanced Packaging 2003 / 08 Vol. 26; Iss. 3

The package integration of rf-mems switch and control ic for wireless applications

De Silva, A.P., Hughes, H.G.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2003.818056
Date:
August, 2003
File:
PDF, 1.31 MB
english, 2003
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