Accurate power supply and ground plane pair models [for...

IEEE Transactions on Advanced Packaging 1999 / Aug. Vol. 22; Iss. 3

Accurate power supply and ground plane pair models [for MCMs]

Wu, H.H., Meyer, J.W., Keunmyung Lee,, Barber, A.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.784473
Date:
January, 1999
File:
PDF, 263 KB
english, 1999
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