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Mitigation and analysis of arc faults in automotive DC networks
Schoepf, T.J., Naidu, M., Gopalakrishnan, S.Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848552
Date:
June, 2005
File:
PDF, 1.38 MB
english, 2005