Thermal Management versus Full Isolation: Trade Off in Packaging Technologies of Modern SiC Diodes
Gerlach, Rolf, Rupp, Roland, Türkes, Peter, Otremba, RalfVolume:
679-680
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.679-680.742
Date:
March, 2011
File:
PDF, 303 KB
english, 2011