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Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints
Qin, H.B., Li, W.Y., Zhou, M.B., Zhang, X.P.Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.052
Date:
December, 2014
File:
PDF, 4.01 MB
english, 2014