Improving the power cycling performance of the emitter...

Microelectronics Reliability 2014 / 12 Vol. 54; Iss. 12

Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts

Özkol, Emre, Hartmann, Samuel, Pâques, Gontran
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.08.015
Date:
December, 2014
File:
PDF, 2.00 MB
english, 2014
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