Technology application tradeoff studies in multichip...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1994 / 5 Vol. 17; Iss. 2

Technology application tradeoff studies in multichip systems

Sandborn, P.A., Hashemi, H., Bal, L., Abadir, M.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.330434
Date:
May, 1994
File:
PDF, 984 KB
english, 1994
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